CN/EN


The NS83205C uses Chip Scale Packaging(CSP) techniques to achieve the industry advanced 1.6 x 1.2 mm footprint and 0.60mm max height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B5
SAW
CSP 1.6 x 1.2 mm
1.6/2.2
Unbalanced
Production
5000