CN/EN


The NS83112B uses Chip Scale Packaging(CSP) techniques to achieve the industry advanced 1.8 x 1.4 mm footprint and 0.55 mm typical height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B12
SAW
CSP 1.8 x 1.4 mm
2.0/2.8
Unbalanced
Production
5000