CN/EN
Search
The NS83105C uses Chip Scale Packaging (CSP) techniques to achieve the industry advanced 1.8 x 1.4 mm footprint and 0.55 mm max height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B3
SAW
CSP 1.8 x 1.4 mm
1.5/1.9
Unbalanced
Production
5000
Address：Room 801, Building 3, 136 Zhongkang Road, NEXT Park, Futian District, Shenzhen
Phone No.：0755-86963703
Email：official_accounts@newsonictech.com
