CN/EN


The NS83266A uses Chip Scale Packaging (CSP) techniques to achieve the industry advanced 1.6 x 1.2 mm footprint and 0.6 mm max height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B66
SAW
CSP 1.6 x 1.2mm
1.7/2.5
Unbalanced
Production
5000