CN/EN


The NS83112C uses Chip Scale Packaging(CSP) techniques to achieve the industryadvanced 1.8 x 1.4 mm footprint and 0.55 mm typical height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B
SAW
CSP 1.8 x 1.4 mm
1.7/2.6
Unbalanced
Production
5000