CN/EN


The NS83166A uses Chip Scale Packaging (CSP) techniques to achieve the industry advanced 1.8 x 1.4 mm footprint and 0.6 mm max height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B66
SAW
CSP 1.4 x 1.1 mm
1.8/2.3
单端
量产
5000