CN/EN


The NS73120B uses Chip Scale Packaging(CSP) techniques to achieve the industry advanced 1.8 x 1.4 mm footprint and 0.55 mm typical height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B20
TC-SAW
CSP 1.8 x 1.4 mm
1.6/1.8
单端
量产
5000