CN/EN


The NS83105D uses Chip Scale Packaging(CSP) techniques to achieve the industry advanced 1.8 x 1.4 mm footprint and 0.55 mm typical height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B5
SAW
CSP 1.8 x 1.4 mm
1.7/2.2
单端
量产
5000