CN/EN


The NS73220B uses Chip Scale Packaging (CSP) techniques to achieve the industry advanced 1.6 mm x 1.2 mm footprint and 0.55mm typical height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B20
TC-SAW
CSP 1.6 x 1.2 mm
1.7/2.0
单端
量产
5000