CN/EN


The NS73226A uses Chip Scale Packaging (CSP) techniques to achieve the industry advanced 1.6 x 1.2 mm footprint and 0.55 mm typical height.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B26
SAW
CSP 1.6 x 1.2mm
2.0/2.2
Unbalanced
Production
5000